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COLEGIO DE INGENIEROS ESPECIALISTAS DE CORDOBA
Ley 7673
CURSOS Y SEMINARIOS
01/03/2017
Next Generation Cloud Data Center Interconnects
Title: Next Generation Cloud Data Center Interconnects
The smart phone revolution, which started about 10 years ago, created an explosion of new end-user and consumer applications, and started an exponential increase in the amount of data and internet traffic being generated. Around the same time, video streaming, e-commerce, social networking, 3G wireless, cloud computing, and Internet of Things further increased traffic demand. And more recently, the push for virtual reality devices, augmented reality education and gaming, autonomous vehicles, chatbots, artificial intelligence, and genomics will require even more application bandwidth and lower latency. The first part of this presentation will explore the new service provider and cloud infrastructure needed to support these new applications. It will include an overview of cloud data center architectures, as well as the latest advances in DSP, optical interconnects and data movement integrated circuits.
The second part of the presentation will discuss data center interconnect technologies currently under development at Inphi Argentina S.A. Inphi is a rapidly growing multi-national company, focused on service provider and cloud markets, with a large research and development center in Cordoba which employs more than 80 engineers.
The smart phone revolution, which started about 10 years ago, created an explosion of new end-user and consumer applications, and started an exponential increase in the amount of data and internet traffic being generated. Around the same time, video streaming, e-commerce, social networking, 3G wireless, cloud computing, and Internet of Things further increased traffic demand. And more recently, the push for virtual reality devices, augmented reality education and gaming, autonomous vehicles, chatbots, artificial intelligence, and genomics will require even more application bandwidth and lower latency. The first part of this presentation will explore the new service provider and cloud infrastructure needed to support these new applications. It will include an overview of cloud data center architectures, as well as the latest advances in DSP, optical interconnects and data movement integrated circuits.
The second part of the presentation will discuss data center interconnect technologies currently under development at Inphi Argentina S.A. Inphi is a rapidly growing multi-national company, focused on service provider and cloud markets, with a large research and development center in Cordoba which employs more than 80 engineers.
Speakers: Dr. Ford Tamer and Dr. Oscar Agazzi
Dr. Ford Tamer is the President and Chief Executive Officer of Inphi Corporation. Dr. Tamer has over 20 years of experience building successful technology businesses, with particular expertise in the semiconductor sector. Prior to joining Inphi, Dr. Tamer served as CEO of Telegent Systems, Senior VP and General Manager of Broadcom's Infrastructure Networking Group, which he grew to $1.2 billion in revenue in five years, CEO of Agere Inc. which was acquired by Lucent Microelectronics, and VP at Agere Systems. Dr. Tamer was also a partner at Khosla Ventures, where he assisted in the growth of cleantech and IT businesses.
He currently serves as Chairman of the Board of Sentons Inc. Dr. Tamer holds an M.S. and Ph.D. in engineering from MIT.
Dr. Oscar Agazzi serves as Inphi’s Vice President of Engineering, Coherent DSP. He joined Inphi after the company acquired ClariPhy in December 2016. At ClariPhy, Dr. Agazzi was the company’s Senior Vice President of Engineering and Chief Architect. Prior to joining ClariPhy, Dr. Agazzi worked at Broadcom Corporation, where he was the chief architect of the BCM5400 family of Gigabit Ethernet (1000BASE-T) transceivers. He also played an instrumental role in the development of Broadcom’s 10-Gigabit Ethernet optical and copper transceivers.
Previously he served at Lucent Technologies Bell Laboratories and was appointed Bell Labs Fellow, the most prestigious distinction awarded by Bell Labs to its research staff. Dr. Agazzi holds an Electrical and Electronic Engineer degree and a Licentiate in Physics from the University of Cordoba, Argentina and a Ph.D. in Electronic Engineering from the University of California at Berkeley. He has 150 patents issued or pending, has published more than 60 technical papers in journals and conferences and is a Fellow of the IEEE.
Dr. Ford Tamer is the President and Chief Executive Officer of Inphi Corporation. Dr. Tamer has over 20 years of experience building successful technology businesses, with particular expertise in the semiconductor sector. Prior to joining Inphi, Dr. Tamer served as CEO of Telegent Systems, Senior VP and General Manager of Broadcom's Infrastructure Networking Group, which he grew to $1.2 billion in revenue in five years, CEO of Agere Inc. which was acquired by Lucent Microelectronics, and VP at Agere Systems. Dr. Tamer was also a partner at Khosla Ventures, where he assisted in the growth of cleantech and IT businesses.
He currently serves as Chairman of the Board of Sentons Inc. Dr. Tamer holds an M.S. and Ph.D. in engineering from MIT.
Dr. Oscar Agazzi serves as Inphi’s Vice President of Engineering, Coherent DSP. He joined Inphi after the company acquired ClariPhy in December 2016. At ClariPhy, Dr. Agazzi was the company’s Senior Vice President of Engineering and Chief Architect. Prior to joining ClariPhy, Dr. Agazzi worked at Broadcom Corporation, where he was the chief architect of the BCM5400 family of Gigabit Ethernet (1000BASE-T) transceivers. He also played an instrumental role in the development of Broadcom’s 10-Gigabit Ethernet optical and copper transceivers.
Previously he served at Lucent Technologies Bell Laboratories and was appointed Bell Labs Fellow, the most prestigious distinction awarded by Bell Labs to its research staff. Dr. Agazzi holds an Electrical and Electronic Engineer degree and a Licentiate in Physics from the University of Cordoba, Argentina and a Ph.D. in Electronic Engineering from the University of California at Berkeley. He has 150 patents issued or pending, has published more than 60 technical papers in journals and conferences and is a Fellow of the IEEE.
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